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02020-dsh-001-f mindspeed technologies ? october 2007 mindspeed proprietary and confidential m02020 4 gbps cmos tia with agc applications ? fibre channel transcei vers (1x, 2x and 4x) 4.25 gbps rosa sff/sfp modules atm/sonet 4 km and 10 km single-mode links the m02020 is a 4 gbps tia achieving a wide input dynamic range to support different transmission distance requirements. input overload of 2 ma pp is provided to support short-haul fiber optic systems and input sensitivity of approximately -23 dbm is useful for single-mode tests of high power long haul links. in order to satisfy such high sensitivity and good optical overload requirements, automatic gain control (agc) is implemented in the m02020. the agc monitors the output amplitude and automatically reduces the tia gain when the photodiode current exceeds the agc threshold, maintaining the output at a constant level. a replica of the average photodiode current is available at the mon pad for photo-alignment and receive power monitoring (sff-8472 compliant). typical applications diagram ac-coupled to limiting amplifier limiting amplifier pina dout doutb v cc pink 1 nf m02020 rm mon v cc gnd tia bond pad to can lead features typical -22.8 dbm sensitivity data rates to 4.25 gbps no filter (pink) capacitor required agc provides dynamic range of 27 db 3.6 k ? differential transimpedance 4 ma pp overload input current photodiode current monitor internal or external bias for photodiode single +3.3v supply same pad layout and die si ze as m02011/13/14/15/16/24/26
02020-dsh-001-f mindspeed technologies ? ii mindspeed proprietary and confidential ordering information part number package operating temperature m02020-12 waffle pack ?40 c to 95 c M02020-22 sawn quartered wafer ?40 c to 95 c m02020-32 expanded whole wafer on a ring ?40 c to 95 c revision history revision level date asic revision description f released october 2007 -12 update ac specifications ( table 1-4 ) based on final charact erization results. add description of monitor output in section 3.2.4 . correct monitor output compliance voltage requirements in section 4.2 . e preliminary july 2007 -12 add specific ordering info rmation versus requesting th e customer to contact the sales office. d preliminary june 2007 -12 add applications information. restore dout and dout pad information to reflect updated device pad out. modify specifications based on initial device evaluation. c advance december 2006 -11 updated pad location information (pad centers moved 9 m toward the die edge), update dout and dout location. update figure 4-1 . b advance november 2006 -11 update specifications based on final design parameters. a advance june 2006 -11 initial release. typical eye diagram eye diagram for 4.25 gbps at -23 dbm input power pad configuration mon pina pink v cc agc dout gnd gnd nc 1 2 3 4 56 7 8 11 12 v cc dout nc 9b 9a 9c 10b 10a 10c die size 1090 x 880 m
02020-dsh-001-f mindspeed technologies ? 1 mindspeed proprietary and confidential 1.0 product specification 1.1 description of key specifications 1.1.1 input referred noise in the design of a transimpedance amplifier, the primary goal is to minimize the input referred noise of the amplifier. this achieves the best s/n ratio for optimum bit error rate performance of the incoming optical data stream. the noise performance of a tia is a key specification for meeting the stringent optical sensitivity requirement. in general, the input referred noise calculatio ns for a tia are identical to those in other conventional amplifiers. the input referred noise can be determined from several methods. traditionally at mindspeed, tia noise is obtained from dividing the output rms voltage nois e of the tia by the transimpedance. the small signal transimpedance of the tia can be calculated by applying a known p-p input current and then measuring the p-p differential output voltage. the equations used for i n (input referred noise) and g tia (transimpedance) are shown below. the tia output rms no ise can be measured convenie ntly by using a wide band oscilloscope (or by using a power meter and converting the noise power to noise voltage). i n = (vout rms / g tia ) g tia = (vout pp / i_input pp ), where: i n = input referred noise in rms g tia = tia small signal transimpedance i_input pp = p-p input current 1.1.2 optical input sensitivity tia input sensitivity can be calculated from the optical sensitivity equation directly based on the input referred noise, photodiode responsivity and transmi tter extinction ratio information. note that the signal to noise (s/n) must exceed 14.1 to achieve a system bit error rate (ber) of 1x10 - 12 . sensitivity = 10log {((s/n x i n x (er + 1)) / (2 x x er ? 1)) x 1000} dbm where: sensitivity = input sensitivity expressed in average power s/n = 14.1(for 10 - 12 ber) i n = input referred noise in rms er = extinction ratio = 10 (typically) = photodiode responsivity = 0.9 (typically)
product specification 02020-dsh-001-f mindspeed technologies ? 2 mindspeed proprietary and confidential 1.2 absolute maximum ratings these are the absolute maximum ratings at or beyond which the ic can be expected to fail or be damaged. reliable operation at these extremes for any length of time is not implied. 1.3 recommended operating conditions 1.4 dc characteristics table 1-1. absolute maximum ratings symbol parameter rating units v cc power supply (v cc -gnd) -0.4 to +4 v t a operating ambient -40 to +95 c t stg storage temperature -65 to +150 c i in pina input current 8 (1) ma pp v pina , v pink , v dout , v doutb ,v agc , v mon maximum input voltage at pina, pink, dout , doutb, agc and mon -0.4v to vcc +0.4v v i pink maximum average current sourced out of pink 10 ma i dout , i doutb maximum average current sourced out of dout and doutb 10 ma notes: 1. equivalent to 4.9 ma average current. table 1-2. recommended operating conditions parameter rating units v cc power supply (v cc - gnd) 3.3 10% v c pd max. photodiode capacitance (v r = 1.7v when using pink), for 4.3 gbps data rate 0.5 pf t a operating ambient temperature -40 to +95 c r load recommended differential output loading 100 (1) ? notes: 1. 100 ? is the load presented by the post amp. table 1-3. dc characteristics symbol parameter min typ max units v b photodiode bias voltage (pink - pina) 1.7 2.0 ? v v cm common mode output voltage ? 1.45 ? v i cc supply current (no loads) ? 44 50 ma
product specification 02020-dsh-001-f mindspeed technologies ? 3 mindspeed proprietary and confidential 1.5 ac characteristics v cc = +3.0v to +3.6v, t a = -40 c to +95 c. typical values are at t a = 25 c, v cc = 3.3v, c pd = 0.5 pf, l in = 1.0 nh unless otherwise noted (1) table 1-4. ac characteristics parameter conditions minimum typical maximum units small signal bandwidth -3db elec trical (below agc turn-on, linear gain region) 2.25 3.4 ? ghz small signal transimpedance differential output (below agc turn- on, linear gain region) 2250 3600 4500 ? overload input current (2) 2.0 4.0 ? ma pp maximum differential ou tput swing iin range: 80 a pp ? 4.0 ma pp 150 280 ? mv pp input referred noise (3) 1.0625 gbps (800 mhz, bessel filter) ? 270 380 na rms 2.125 gbps (1.6 ghz, bessel filter) ? 375 530 4.25 gbps (3.2 ghz, bessel filter) ? 550 700 duty cycle distortion (dcd) iin ra nge: from sensitivity to overload ? 515ps pp deterministic jitter (dj) iin range: from sensitivity to overload (includes dcd) ?13 30 ps pp output resistance differential output 80 100 120 ? agc settling time to reach 1% of agc final value within six time constants ? 2.4 ? s low frequency cut-off -3db el ectrical, below agc kick-in ? 17 25 khz photodiode current monito r offset no input current ? 0.2 1.0 a photodiode current monitor accuracy (4) iin range: 3 a avg ? 3.0 ma avg after offset removed, v mon = 0 ? 2.0v ? 0 1db photodiode current monitor gain ratio v mon = 0 to 2.0v ? 1:1 ?? power supply rejection ratio dc to 1 mhz ? 30 ? db optical input sensitivity (5) 1.0625 gbps (800 mhz, bessel filter) ? -25.9 ? dbm 2.125 gbps (1.6 ghz, bessel filter) ? -24.5 ? 4.25 gbps (3.2 ghz, bessel filter) -21.7 -22.8 ? notes: 1. die parameters are production tested at room temperature only, but are guaranteed by design and characte rization to operate o ver an ambient temperature range (t a ) of -40 c to +95 c and v cc range of 3.0 to 3.6v. 2. overload is the largest p-p input current that the m02020 accepts while meeting specifications. 3. input referred noise is derive d by calculation as (rms out put noise) / (gain at 100 mhz). 4. includes variation over supply and temperature. 5. measured by using 10 -12 ber. assume transmitter extinc tion ratio is 10 db and responsivity of photo diode is 0.9 a/w.
02020-dsh-001-f mindspeed technologies ? 4 mindspeed proprietary and confidential 2.0 pad definitions table 2-1. pad descriptions die pad # name function 1 agc monitor or force agc voltage. 2v cc power pin. connect to most positive supply. 3 pink common pin input. connect to photo diode cathode. (1) 4 pina active pin input. c onnect to photo diode anode. 5v cc power pin. connect to most positive supply (only one v cc pad needs to be connected). 6 mon analog current source output. current matched to averag e photodiode current. 7dout differential data output (goe s low as light increases). 8 nc no connect. leave floating. 9 gnd ground pin. connect to the most negative supply. (2) 10 gnd ground pin. c onnect to the most negative supply. (2) 11 nc no connect. leave floating. 12 dout differential data output (goes high as light increases). na backside backside . connect to the lowest potential, usually ground. notes: 1. alternatively the photodiode cathode may be conn ected to a decoupled positive supply, e.g. v cc . 2. all ground pads are common on the die. only one ground pad need s to be connected to the to-can ground. however, connecting mo re than one ground pad to the to-can ground, particularly those across the di e from each other can improve performance in noisy environment s. figure 2-1. bare die layout mon pina pink v cc agc dout gnd gnd nc 1 2 3 4 56 7 8 11 12 v cc dout nc 9b 9a 9c 10b 10a 10c
02020-dsh-001-f mindspeed technologies ? 5 mindspeed proprietary and confidential 3.0 functional description 3.1 overview the m02020 is a 4g tia with a wide input dynamic range to support different transmission distance requirements. input overload of 4ma pp is provided to support short-haul fiber-optic systems. in addition, input sensitivity of approximately -23 dbm is provided for longer-reach atm/sonet systems. in order to satisfy such high sensitivity and good optic al overload requirements, automatic gain control circuit (agc) is implemented in the m02020. the agc monitors the output amplitude and automatically reduces the tia gain when the photodiode current exceeds the agc threshold, maintaining the output at a constant level. a replica of the average photodiode current is available at the mon pad for photo-alignment and 'loss of signal' detecting. figure 3-1. m02020 block diagram dc restore phase splitter agc dout dout agc tia mon dc servo level shift output pina pink voltage reg
functional description 02020-dsh-001-f mindspeed technologies ? 6 mindspeed proprietary and confidential 3.2 general description 3.2.1 tia (transimpedance amplifier) the transimpedance amplifier consists of a high gain single-ended cmos amplifier (tia) with a feedback resistor. the feedback creates a virtual ground low impedance at the input and virtually all of the input current passes through the feedback resistor defining the voltage at th e output. advanced cmos design techniques are employed to maintain the stability of this stage across all input conditions. an on-chip low dropout linear regulator has been incorporated into the design to give excellent noise rejection up to several mhz. the circuit is designed for pin photodiodes in the ?grounded cathode? configuration, with the anode connected to the input of the tia and the cathode connected to ac ground, such as the provided pink terminal. reverse dc bias is applied to reduce the photodiode capacitance. avalanche photodiodes can be connected externally to a higher voltage. 3.2.2 agc the m02020 has been designed to operate over the input range of +6 dbm to -23 dbm. this represents a ratio of 1:500 whereas the acceptable dynamic range of the output is only 1:30 which implies a compression of 16:1 in the transimpedance. the design uses a mos transistor operating in the triode region as a ?voltage controlled resistor? to achieve the transimpedance variation. another feature of the agc is that it only operates on signals greater than ?12.5 dbm (@ 0.9 a/w). this knee in the gain response is important when setting ?signal detect? functions in the following post amplifier. it also aids in active photodiode alignment. the agc pad allows the agc to be disabled during photodiode alignment by grounding the pad through a low impedance. the agc control voltage can be monitored during normal operation at this pad by a high impedance (>10 m ? ) circuit. 3.2.3 output stage the signal from the tia enters a phase splitter followed by a dc-shift stage and a pair of voltage follower outputs. these are designed to drive a differential (100 ? ) load. they are stable for driving capacitive loads such as interstage filters. since the m02020 exhibits rapid roll-off (3 pole), simple external filtering is sufficient. 3.2.4 monitor o/p high impedance output sources a replica average photodiode current for photo-alignment and monitoring purposes. this output is compatible with the ddmi receive power specification (sff-8472) and mindspeed?s ddmi controller products. ensure that the voltage on v mon is in the range of 0 to 2v. refer to figure 4-1 .
02020-dsh-001-f mindspeed technologies ? 7 mindspeed proprietary and confidential 4.0 applications information 4.1 recommended pin diode connections figure 4-1. suggested pin diode connection methods note: selection of rm depends on the maximum input current as detailed in ta bl e 4 - 1 . note: the monitor output is not usable if pink does not bias the pd. alternative circuit: external pd/apd bias pina dout doutb v cc pink 1 nf 500 ? 470 pf m02020 pdc_bias v cc pdc mon gnd tia bond pad to can lead recommended circuit tia bond pad to can lead pina dout doutb v cc pink 1 nf m02020 rm mon v cc gnd
applications information 02020-dsh-001-f mindspeed technologies ? 8 mindspeed proprietary and confidential 4.2 monitor o/p high impedance output sources a replica average photodiode current for photo-alignment use. this output is compatible with the ddmi receive power specification (sfp-8472) and mindspeed?s ddmi controllers. ensure that the voltage on v mon is in the range of 0 to 2.0v. refer to figure 4-1 . 4.3 to-can layout table 4-1. selection of rm for maximum input current i in max (ma) optical power (dbm) rm ( ? ) 4 +6 500 2 +3 1000 1 0 2000 0.5 -3 4000 figure 4-2. typical layout diagram with photodiode mounted on submount (5 pin to-can) notes: typical application inside of a 5 lead to-can. it is only necessary to bond one v cc pad and one gnd pad. however, bondi ng both of each ground pads is encourag ed for improved performance in noisy environments. the backside must be connected to the lowest potential, usuall y ground, with conductive epoxy or a similar die attach material. if a monitor output is not required then a 4 lead to-can may be used. mon pina pink v cc agc do ut gnd gnd nc v cc dout nc v cc mon dout doutb 1nf shim
applications information 02020-dsh-001-f mindspeed technologies ? 9 mindspeed proprietary and confidential 4.4 treatment of pink pink does not require capacitor bypassing when powering a p hoto diode or if pink is not used to bias the photo diode. figure 4-3. typical layout diagram with photod iode mounted on to-can base (5 pin to-can) notes: typical application inside of a 5 lead to-can. it is only necessary to bond one v cc pad and one gnd pad. however, bondi ng both of each ground pads is encourag ed for improved performance in noisy environments. the backside must be connected to the lowest potential, usuall y ground, with conductive epoxy or a similar die attach material. if a monitor output is not required then a 4 lead to-can may be used. mon pina pink v cc agc do ut gnd gnd nc v cc dout nc v cc mon dout doutb 1nf
applications information 02020-dsh-001-f mindspeed technologies ? 10 mindspeed proprietary and confidential 4.5 t0-can assembly recommendations figure 4-4. to-can assembly diagram m02020 ceramic shim submount to can leads pin diode to-can header ceramic shim submount to can leads to-can header not recommended example recommended example metal shim @4 or 5 m02020 pin diode @4 or 5 this bond is too long and unreliable this bond is unreliable
applications information 02020-dsh-001-f mindspeed technologies ? 11 mindspeed proprietary and confidential 4.5.1 assembly the m02020 is designed to work with a wirebond inductance of 1 nh 0.25 nh. many existing to-can configurations will not allow wirebond lengths that short, since the pin di ode submount a nd the tia di e are more than 1 mm away in the vertical direction, due to the need to have the pin diode in the correct focal plane. this can be remedied by raising up the tia di e with a conductive metal shim. this will effectively reduce the bond wire length. refer to figure 4-4 above for details. mindspeed recommends ball bonding with a 1 mil (25.4 m) gold wire. for performance reasons the pina pad has less via material connected to it. it therefore requires more care in setting of the bonding parameters. for the same reason pina has reduced esd protection. in addition, please refer to the mindspeed product bulletin (document number 0201x-pbd-002). care must be taken when selecting chip capacitors, since they must have good low esr characteristics up to 1.0 ghz. it is also important that the termination materials of the capacitor be compatible with the attach method used. for example, tin/lead (pb/sn) solder finish capacitors are incompatible with silver-filled epoxies. palladium/silver (pd/ag) terminations are compat ible with silver filled epoxies. solder can be used only if the substrate thick-film inks are compatible with pb/sn solders. 4.5.2 recommended assembly procedures for esd protection the following steps are recommended for to-can assembly: a. ensure good humidity control in the environment (to help minimize esd). b. consider using additional ionization of the air (also helps minimize esd). c. as a minimum, it is best to ensure that the body of the to-can header or the ground lead of the header is grounded through the wire-bonding fixture for the following steps. the wire bonder itself should also be grounded. 1. wire bond the ground pad(s) of the die first. 2. then wire bond the v cc pad to the to-can lead. 3. then wire bond any other pads going to the to-can leads (such as dout, dout and possibly mon) 4. next wire bond any capacitors inside the to-can. 5. inside the to-can, wire bond pink. 6. the final step is to wire bond pina.
02020-dsh-001-f mindspeed technologies ? 12 mindspeed proprietary and confidential 5.0 die specification figure 5-1. bare die layout mon pina pink v cc agc dout gnd gnd nc 1 2 3 4 56 7 8 11 12 v cc dout nc 9b 9a 9c 10b 10a 10c pad number pad x y pad number pad x y 1 agc -76 338 9c (1, 2) gnd 375 -338 2 (1) v cc -228 338 9b (1, 2) gnd 443 -270 3 pink -443 124 9a (1, 2) gnd 443 -124 4 pina -443 -124 10a (1, 2) gnd 443 124 5 (1) v cc -228 -338 10b (1, 2) gnd 443 270 6 mon -76 -338 10c (1, 2) gnd 375 338 7 dout 76 -338 11 (3) nc 228 338 8 (3) nc 228 -338 12 dout 76 338 notes: 1. it is only necessary to bond one v cc pad and one gnd pad. however, bonding both gnd pads is encouraged for improved performance in noisy environments. 2. each location is an acceptable bonding location. 3. leave floating. process technology: cmos, si licon nitride passivation die thickness: 300 m pad metallization: aluminum die size: 1090 m x 880 m pad openings: 72 m sq. pad centers in m referenced to center of device connect backside bias to ground
www.mindspeed.com general information: telephone: (949) 579-3000 headquarters - newport beach 4000 macarthur blvd., east tower newport beach, ca 92660 ? 2006, 2007 mindspeed technologies ? , inc. all rights reserved. information in this document is provided in connection with mindspeed technologies ? ("mindspeed ? ") products. these materials are provided by mindspeed as a service to its customers and may be used for informational purposes only. except as provided in mindspeed?s terms and conditions of sale for such products or in any separate agreement related to this document, mindspeed assumes no liability whatsoever. mindspeed assumes no responsibility for errors or omission s in these materials. mindspeed may make changes to specifications and product descriptions at any time, without notice. mindspeed makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incom patibilities arising from future changes to its specifications and product descriptions. no license, ex press or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. these materials are provided "as is" withou t warranty of any kind, either express or implied, relating to sale and/or use of mindspeed products including liability or warranties relating to fitness for a particular purpose, consequential or incidental damages, merchantability, or infringement of any patent, copyright or other intellectual property right. mindspeed further does not warrant the accuracy or completeness of the information, text, graph ics or other items contained within these materials. mindspeed shall not be liable fo r any special, indirect, incidental, or consequential damages, including without li mitation, lost revenues or lost profits, which may result from the use of these materials. mindspeed products are not intended for use in medical, lifesaving or life sustaining applications. mindspeed customers using or selling mindspeed pr oducts for use in such applications do so at their own risk and agree to fully indemnify mindspeed for any damages resulting from such improper use or sale. 02020-dsh-001-f mindspeed technologies ? 13 mindspeed proprietary and confidential

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